You can select between Standard and Advanced manufacturing capabilities depending on your design complexity, density, and performance targets. Each option defines clear limits for trace geometry, drilling, thickness control, and registration accuracy.
Core Capability Comparison
| Feature | Standard | Advanced |
|---|---|---|
| Internal Line/Spacing | 3/3 mil | 3/3 mil |
| External Line/Spacing | 4/4 mil | 3/3 mil |
| Minimum Drill Size | 8 mil | 6 mil |
| Aspect Ratio | 10:1 | 15:1 |
| Annular Ring | 10 mil | 8 mil |
| Anti-Pad | 20 mil | 16 mil |
| Plated Hole Tolerance | ±3 mil | ±2 mil |
You gain tighter tolerances and higher density routing with the Advanced option. It supports finer drill diameters, reduced annular rings, and improved layer registration down to ±3 mil.
Stack-Up and Thickness Control
- Minimum dielectric thickness: 3 mil (Standard), 2 mil (Advanced)
- Maximum board thickness: 0.200″ (Standard), 0.250″ (Advanced)
- Thickness tolerance: ±10% (Standard), ±7% to ±5% (Advanced)
- Maximum panel size: up to 16″ × 22″ (Standard), 30″ × 44″ (Advanced)
You can also incorporate blind and buried vias in both options. Via filling, including conductive and non-conductive types, is available under Advanced capability.
Layer-Specific Design Limits
For inner and outer layers, you can route down to 3 mil line width and spacing under Advanced rules. Minimum pad and anti-pad dimensions scale with drill size, supporting tighter high-density interconnect layouts.
Solder mask clearance can be reduced to 3 mil, with mask web thickness controlled to as low as 3.4 mil, enabling finer pitch component placement while maintaining manufacturability.
